Problem Solved
Electronic devices, especially those with semiconductor chips, generate significant heat during operation. Traditional cooling methods often struggle with efficiently dissipating this heat, leading to overheating and reduced performance. Prior technologies may lack the ability to effectively manage heat in compact or high-performance systems.
Core Features
This invention introduces a 3D cooling block designed to enhance heat dissipation in electronic devices. It features a box with a base plate, a 3D heat exchanger, and circulating liquid. The heat exchanger includes a heat pipe or vapor chamber structure with multiple fin layers, creating channels for liquid flow. The circulating liquid absorbs and removes heat from the device efficiently.
Inventive Step
The unique aspect of this invention lies in its 3D heat exchanger design, which integrates a vapor chamber structure with multiple fin layers and channels. This configuration allows for improved heat transfer and dissipation compared to traditional flat or 2D designs. The use of U-shaped heat pipes and vapor chambers enhances the cooling efficiency, providing a novel solution to heat management challenges.
Benefits
The 3D cooling block offers superior heat dissipation, potentially extending the lifespan and performance of electronic devices. It can be particularly beneficial for high-performance computing systems, where efficient cooling is critical. The design also allows for scalability, making it adaptable for various electronic applications.
Broader Impact
This invention could revolutionize cooling systems in electronics, leading to more reliable and efficient devices. It supports the development of more powerful and compact electronics, contributing to advancements in technology and sustainability by reducing energy consumption associated with cooling.